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A New Technical Conference is Here!
IPC has launched a new conference and exhibition in the heart of the Midwest and
you are invited to get in on the ground floor of this inaugural industry event.
Take part in the Midwest's premier technical conference on all aspects of
electronics manufacture - board design and manufacture, electronics assembly,
and test.
Presentations from technical experts are sought on all relevant
subjects, including:
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Lead Free Implementation
- Printed Board Solderability
- Solder Joint Reliability
- Tin Whiskers
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Board Fabrication
- Advances in Plating Technology
- Advances in Flex and Rigid-Flex
- Via Fill Technology
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Board Design
- Embedded Passives
- Advances in CAD/CAM
- Fine Pitch Design
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Assembly Technology
- BGA Attachment Reliability
- Rework and Repair
- No Clean Processes
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Board Materials
- New Laminates
- Materials Testing
- High Frequency Laminates
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Benefits of Participating
Increase your visibility in the industry, and that of your company, by
participating in the IPC Midwest Conference & Exhibition 2009 technical
conference. Many industry leaders use the research and findings from conference
proceedings when they develop industry standards and guidelines.
Technical Papers and/or Presentations
The Technical Conference will be held Wednesday, September 28 and Thursday,
September 29, 2009. Abstracts for unpublished work should be submitted detailing
case histories, field data, new technologies or innovations or research and
findings. In addition, abstracts should summarize the problems and resolutions,
methods used results of experiments and benefits to the industry.
Presentations at the conference may be thirty minutes in length. They may be
grouped together in a forum or panel discussion.
Presentations must be non-commercial in nature, focusing on technology rather
than a company's product. Those deemed commercial by the Technical Program
Committee will not be accepted.
Abstracts must be submitted by April 18, 2009.
Submit your paper abstract online
Professional Development Courses
PProfessional Development Courses will be held Monday, September 21 and Tuesday,
September 22, 2009. Proposals are solicited from individuals interested in
teaching full-day (six hours) or half-day (three hours) Professional Development
Courses on design, printed circuit board and electronic manufacturing processes
and materials.
Proposals including course descriptions must be submitted by April 18, 2009. A
master copy of the course workbook must be submitted by August 21, 2009. An
honorarium is offered to Professional Development Instructors. Contact Michelle
Michelotti at 847-597-2822 for more information.
Submit your course proposal online
Proceedings
Please note: It is mandatory for all speakers and instructors to provide an
electronic copy of their technical paper and/or presentation slides.
The deadline for paper/visuals submission is August 21, 2009.
Conference Speaker Benefits
All conference speakers at IPC Midwest Conference & Exhibition 2009, will
receive free conference admission and a complimentary copy of the conference
Proceedings on CD.
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