Call for Posters
IPC Midwest Conference and Exhibition 2008
On
Design, Printed Circuit Boards, Electronics Assembly and Test
March 30 – April 3, 2008
Las Vegas, Nevada
Submit an abstract for the industry’s premier conference on electronics manufacturing in a new exciting location — Las Vegas. Gain significant visibility for you and your company on your research and knowledge. Thousands of individuals will attend
IPC Midwest Conference and Exhibition 2008, ensuring that your work
is seen by key engineers, managers and executives from all segments of the electronic
interconnection industry worldwide. The new venue in Las Vegas promises to raise your global exposure due to the worldwide appeal of this world-famous destination.
Poster Topics:
Submissions are sought in all areas of the electronics industry, including design, materials, assembly, processes, and equipment, especially:
- Design
- Embedded Passive & Active Devices
- Flexible Circuitry
- High Frequency
- Lead Free Issues
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- Fabrication
- Rework & Repair
- RFID Circuitry
- SMT Assembly
- Test & Inspection
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Requirements for Submission
Provide an abstract of up to 300 words that summarizes technical and previously unpublished, non-commercial work covering case histories, research and discoveries. It must be received by January 30, 2008.
Conference Benefits
Conference speakers are entitled to a copy of the Proceedings and a free One-Day Conference Pass for the day of your presentation.
Please Note
Previously published papers and papers focused on a company or its products are not appropriate and will not be accepted.
For more information about poster participation or if you have any other interest
in participating, contact Greg Munie, Conference Director, at GregMunie@ipc.org or Toya Richardson at +1 847-597-2825.
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