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FF01: Emerging Advanced Packages: Stacked, 3-D, CSP, Embedded — Surviving the Board Assembly Process
Wednesday, September 24, 10:00 am-11:00 am
Moderator: Gail Flower, editor-in-chief, SMT Magazine
Panelists:
- Vern Solberg, STC–Madison
- Gene Dunn, Panasonic Engineering
- Dongkai Shangguan, Flextronics International
- Jacques Coderre, Unovis Solutions
Consumers are demanding smaller, lighter electronic devices with higher performance and more features. This pressure has driven innovative, small, cost-effective package designs in many formats.
Due to shorter product lifecycles, and because boundaries are blurring, from Fab to packaging to board assembly, each portion of the supply chain needs to know how to handle thinner, delicate, smaller, vertically stacked, or embedded components. With the current gap in capabilities between traditional processes and newer technologies, collaboration across the supply chain holds the key. EMS providers must look at volume production solutions — starting with how engineers bring technology from R&D to high-volume production. Developing solutions in parallel early in the supply chain and understanding the latest emerging package styles can help meet today’s requirements.
In the past, design, fabrication, packaging, testing, board assembly and new product box build happened separately from front-end to back-end to final assembly. Developing in synergy addresses many issues at once. This panel will cover the latest in emerging packages and how these packages can be assembled on boards.
FF02: There’s More Than One Way to Assemble Lead Free: A Status Report on Processes
Wednesday, September 24, 3:15 pm–4:45 pm
Moderator: Leo Lambert, EPTAC Corporation
Since lead-free regulations went into effect, it has become painfully obvious that there is more than one way to build a lead-free electronics assembly. Is one better than another? Have “best practices” emerged?
The IPC certification program for lead-free assembly is unique in that it audits a facility to determine if processes and procedures are in place to produce lead-free assemblies. Based on a 100-item questionnaire, the audit follows the 12 steps of assembly operations, including surface mount assembly, rework and repair, materials declaration, test and inspection, and database tracking.
This session will provide insight on what’s been learned about the lead-free assembly process, including how companies are training their employees on lead free, whether it’s possible to run one line for both leaded and lead-free product, and how companies are verifying that the components and boards are RoHS compliant.
FF03: SCRIBA: A Cross-Platform Data Entry Tool for IPC 175x Version 2.0
Thursday, September 25, 10:15 am-11:45 am
Authors: Eric Simmon (NIST), John Messina (NIST)
The IPC 1752 standard for material declaration (part of the IPC-1750 supplier declaration standard) was released in early 2006 to help companies comply with European Union Directive 2002/95/EC on the Restriction of Hazardous Substances (RoHS).
Since then there have been many changes both in environmental regulations and in how companies manage the information to comply with these regulations.
To address these changes, IPC’s 2-18 subcommittee has updated the IPC-1750 series standards. One of the major differences in version 2.0 is the move away from a form-based tool/transport mechanism to a new configuration that separates software tools from the data exchange standard itself. One concern with the new approach is the increased cost associated with implementing software solutions in small- and medium-sized businesses (SMBs).
To help SMBs implement version 2.0, NIST has developed a free tool for creating and editing individual 175x XML files. The NIST tool, called Scriba, supports the functionality defined in the 1750 series standards. Some of the key functionality includes: multiple part reporting, multiple level reporting, and a digital signature. Scriba is cross platform and works on Windows, OS X, and UNIX based operating systems. This paper describes the design of Scriba and how it may be used as part of a material data management system.
This forum will discuss the details of the version 2.0 schema and provide a demonstration of the Scriba 175x data editing tool. An open discussion will follow.
FF04: Roundtable Discussion: The A-Line and EMS Trends
Wednesday, September 24, 1:30 pm–3:00 pm
Moderator: Meredith Courtemanche, SMT Magazine
Panelists:
- Susan Mucha, Powell-Mucha Consulting, Inc.
- Kevin Stone, Kimball Electronics Group
- James Scholler, Vice President of Technology
- Ross Clark, Morey Corporation
In this interactive session, speakers from the EMS industry will discuss how they evaluate materials and equipment in developing products. Topics will include the development of a souvenir electronic assembly for the IPC Midwest A-Line, selling customers on your capabilities, and the work that goes into prototyping/NPI. Questions about electronics manufacturing in general, and the A-Line in particular are welcome.
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