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IPC Midwest 2009 Schedule Details

Detailed Listing of All Events Chronologically
Event Title Code Time
Friday, September 18, 2009
IPC-A-610 Task Group7-31b8:00 am - 5:00 pm
Saturday, September 19, 2009
IPC-A-610 Task Group7-31b8:00 am - 5:00 pm
Sunday, September 20, 2009
RegistrationReg7:00 am - 5:00 pm
Terms and Definitions Committee2-308:00 am - 9:00 am
J-STD-001 Task Group5-22a8:00 am - 2:30 pm
Joint Meeting - IPC-A-600 and Rigid Printed Board Performance Specifications Task Groups7-31a/D-33a9:00 am - 3:00 pm
Committee Chairman Council (By Invitation)CCC3:00 pm - 4:30 pm
Assembly & Joining Processes Committee (By Invitation)5-204:30 pm - 6:00 pm
Committee Chairman's ReceptionRecpt-Chairman's6:00 pm - 7:00 pm
Monday, September 21, 2009
RegistrationReg7:00 am - 5:00 pm
IPC Cleaning and Coating Committee Overview5-308:00 am - 9:00 am
Product Assurance Committee (By Invitation)7-308:00 am - 9:00 am
Test Coupon and Artwork Generation Task Group1-10c8:00 am - 10:00 am
Thermal Stress Test Methodology SubcommitteeD-328:00 am - 10:00 am
Electronic Documentation Technology Committee2-408:00 am - 12:00 pm
Laminate/Prepreg Materials Subcommittee3-118:00 am - 12:00 pm
Component and Wire Solderability Specification Task Group5-23b8:00 am - 12:00 pm
SMT Processes and Six Sigma Green BeltSMTA8:00 am - 5:00 pm
Potting and Encapsulation Task Group5-33f9:00 am - 12:00 pm
Joint meeting of J-STD-001 Nat'l Std for Soldering and IPC-A-610 Task Groups5-22a/7-31b9:00 am - 5:00 pm
High Speed/High Frequency CommitteeD-2010:15 am - 12:00 pm
Printed Board Process Capability, Quality and Relative Reliability Benchmark Test SubcommitteeD-3610:15 am - 12:00 pm
Committee Awards LuncheonLuncheon-Cmte12:00 pm - 1:30 pm
Woven Glass Reinforcement Task Group3-12d1:30 pm - 3:00 pm
Joint Meeting - Data Generation and Transfer Committee and Product Data Description (Laminar View) Subcommittee2-10/2-131:30 pm - 5:00 pm
Low-Halogen Guideline Task Group4-33a1:30 pm - 5:00 pm
Printed Circuit Board Solderability Specifications Task Group5-23a1:30 pm - 5:00 pm
SIR and Electrochemical Migration Task Group5-32b1:30 pm - 5:00 pm
IPC-A-630 Requirements for Structural Enclosure Task Group7-31j1:30 pm - 5:00 pm
High Speed/High Frequency Board Performance SubcommitteeD-221:30 pm - 5:00 pm
Base Materials Roundtable Task Group3-12e3:15 pm - 5:00 pm
Tuesday, September 22, 2009
RegistrationReg7:00 am - 5:00 pm
Corrosion of Metal Finishes Task Group3-11g8:00 am - 10:00 am
Metallic Foil Task Group3-12a8:00 am - 10:00 am
Space Electronic Assemblies J-STD-001 Addendum Task Group5-22as8:00 am - 10:00 am
Embedded Devices Design SubcommitteeD-518:00 am - 10:00 am
Cleaning & Alternatives Subcommittee5-318:00 am - 12:00 pm
Test Methods Subcommittee7-118:00 am - 12:00 pm
Materials Declaration Task Group2-18b8:00 am - 5:00 pm
Assembly and Joining Handbook Subcommittee7-358:00 am - 5:00 pm
SMT Processes and Six Sigma Green BeltSMTA8:00 am - 5:00 pm
Show Sales OfficeOffice-Sales8:00 am - 6:00 pm
Bottom Termination Components (BTCs) Task Group5-21h9:30 am - 5:00 pm
Halogen-Free Materials Subcommittee4-3310:15 am - 12:00 pm
Flux Specifications Task Group5-24a10:15 am - 12:00 pm
Plated-Through Via (PTV) Reliability-Accelerated Test Methods Task Group6-10c10:15 am - 12:00 pm
CRANE Embedded Passives Committee (By Invitation)CRANE-EP10:15 am - 12:00 pm
Flexible Circuits Specifications SubcommitteeD-1210:15 am - 12:00 pm
Space Electronic Assemblies IPC/WHMA-A-620 Addendum Task Group7-31fs10:15 am - 5:00 pm
Committee Awards LuncheonLuncheon-Cmte12:00 pm - 1:30 pm
Press OfficeOffice-Press1:00 pm - 4:00 pm
Solder Alloy Task Group5-24c1:30 pm - 3:00 pm
Conductive Anodic Filament (CAF) Task Group5-32e1:30 pm - 3:00 pm
High Speed/High Frequency Test Methods SubcommitteeD-241:30 pm - 3:00 pm
SMT Attachment-Reliability Test Methods Task Group6-10d1:30 pm - 5:00 pm
IPC-A-600 Certification Technical Committee7-31at1:30 pm - 5:00 pm
Flexible Circuits Test Methods SubcommitteeD-151:30 pm - 5:00 pm
IPC-2221/2222 Task GroupD-31b1:30 pm - 5:00 pm
Underfill Adhesives for Flip Chip Applications5-24f3:15 pm - 5:00 pm
 5-24f3:15 pm - 5:00 pm
High Frequency Test Methods Task Group: Frequency-Domain MethodsD-24c3:15 pm - 5:00 pm
Committee Reception (Registration Required)Recpt-Cmte5:00 pm - 6:00 pm
Wednesday, September 23, 2009
Speaker Ready RoomSRR7:00 am - 5:00 pm
RegistrationReg7:00 am - 6:00 pm
First Timer's Welcome BreakfastBrkfst-First7:30 am - 8:15 am
Press OfficeOffice-Press8:00 am - 5:00 pm
SMT Processes and Six Sigma Green BeltSMTA8:00 am - 5:00 pm
Show Sales OfficeOffice-Sales8:00 am - 6:30 pm
FREE! Opening Session: A Leaded Engineer in a Lead Free WorldOpen8:30 am - 9:30 am
Supplier Declaration Subcommittee2-189:30 am - 12:00 pm
Process Chemicals Declaration -CANCELLED2-18e9:30 am - 12:00 pm
Solder Paste Task Group5-24b9:30 am - 12:00 pm
Conformal Coating Handbook Task Group5-33c9:30 am - 12:00 pm
A-620 Technical Training Task Group7-31ft9:30 am - 12:00 pm
Covercoat Materials Task GroupD-13b9:30 am - 12:00 pm
High Speed/High Frequency Base Materials SubcommitteeD-239:30 am - 12:00 pm
Printed Board Storage and Handling SubcommitteeD-359:30 am - 12:00 pm
Embedded Component Materials SubcommitteeD-529:30 am - 12:00 pm
Ribbon Cutting CeremonyRibbon9:45 am - 10:00 am
Lead Free Model Cage MatchS0110:00 am - 12:00 pm
Strategies for Fighting CounterfeitingS0210:00 am - 12:00 pm
Challenges in Building a High Reliability Military PWBS0310:00 am - 12:00 pm
Event LuncheonLuncheon-Event12:00 pm - 1:30 pm
Plating Processes Subcommittee4-141:30 pm - 3:00 pm
J-STD-001 Training Task Group5-22bt1:30 pm - 3:00 pm
Flexible Circuits Base Materials SubcommitteeD-131:30 pm - 3:00 pm
Embedded Devices Test Methods SubcommitteeD-541:30 pm - 3:00 pm
IPC Solder Products Value Council: Alloy Testing and Take Action LimitsS041:30 pm - 3:00 pm
The Quality and Reliability View as seen from the Assembly LineS051:30 pm - 3:00 pm
Printed Board Reliability IssuesS061:30 pm - 3:00 pm
Marking, Symbols and Labels for Identification of Assemblies, Components and Devices Task Group4-34b1:30 pm - 5:00 pm
Joint Meeting - Ionic Conductivity and Bare Board Cleanliness Assessment Task Groups5-32a/5-32c1:30 pm - 5:00 pm
IPC-HDBK-620 Handbook Task Group7-31h1:30 pm - 5:00 pm
Reliability and the Solder InterfaceS073:15 pm - 4:45 pm
Environmental IssuesS083:15 pm - 4:45 pm
High Frequency Printed BoardsS093:15 pm - 4:45 pm
Process Effects Handbook Subcommittee7-233:15 pm - 5:00 pm
IPC-A-610 Certification Technical Committee7-31bt3:15 pm - 5:00 pm
Flexible Circuits Design SubcommitteeD-113:15 pm - 5:00 pm
FREE! Show Floor Welcome ReceptionRecpt-Welcome5:00 pm - 6:00 pm
 CCBA6:00 pm - 9:00 pm
Thursday, September 24, 2009
RegistrationReg7:00 am - 5:00 pm
Manufacturing Process Declaration Task Group2-18a8:00 am - 12:00 pm
Laminate Declarations2-18x8:00 am - 12:00 pm
SMT Component Placement Equipment Subcommittee5-418:00 am - 12:00 pm
Press OfficeOffice-Press8:00 am - 5:00 pm
IPC Technology RoadmapFF018:30 am - 10:00 am
Stencil Printing Process for Solder Paste Application — An In-Depth LookPD-019:00 am - 12:00 pm
LGA and QFN Design, Assembly and Rework GuidePD-039:00 am - 12:00 pm
Fundamentals of Solder Joint ReliabilityPD-059:00 am - 12:00 pm
DFM for Manufacturing: When A Six Sigma Process Is Not Sufficient To Achieve A High Yielding Manufacturing ProcessPD-079:00 am - 12:00 pm
Show Sales OfficeOffice-Sales9:00 am - 5:00 pm
Joint Meeting - UL/CSA and UL 796F & UL 746F Task Groups3-11f/D-12a10:00 am - 12:00 pm
Acceptability, Reliability and Failure Analysis Testing CorridorReliability10:15 am - 3:30 pm
Joint Meeting - Roadmap Steering and Planning Committee/JISSO North America Council8-40/JNAC1:00 pm - 5:00 pm
Solder Products Value Council Steering CommitteeSPVC1:30 pm - 5:00 pm
Troubleshooting Your PCB Assembly Yields – On-Site or OffshorePD-022:00 pm - 5:00 pm
Advanced Component Packages and ProcessesPD-042:00 pm - 5:00 pm
Final Finishes and their Compatibility with Lead-Free AssemblyPD-062:00 pm - 5:00 pm
Accelerated Thermal Cycling and Acceleration Factors for Lead-Free Surface Mount AssembliesPD-082:00 pm - 5:00 pm
Industry Advisory Group Meeting for ULUL-IAG2:00 pm - 5:00 pm