| Session Descriptions |
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S01
Reliability Challenges for Bottom Termination Components |
| Wednesday, August 22, 2012 | 9:00 AM - 11:45 AM |
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Moderator:
Dennis Fritz, MacDermid, Inc.
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While the promise of high density component spacing is a sure benefit of bottom termination components, the reduction of conductor pitch, spacing and stand-off height creates its own set of reliability challenges. This session will address LGA packages, QFN float issues related to printed solder paste, the effects of frequency on leakage currents in the presence of flux residue under these types of components, and mitigation or elimination of pad cratering.
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Cleaning Challenges in an HDI World - Phase 3
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- Mike Bixenman, Kyzen Corporation
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QFN Flux Entrapment Case Study
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- Terry Munson, Foresite, Inc.
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Printing and Assembly Challenges for QFN Devices
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- William Coleman, Photo Stencil Inc.
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Pad Cratering On PCBs
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- Trey Adams, Insulectro
- Kenneth Parent, Insulectro
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S02
Assembly Coatings and Alternatives |
| Wednesday, August 22, 2012 | 1:30 PM - 3:00 PM |
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Moderator:
Neil Bolding, MacDermid Autotype Inc
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Today’s printed board assemblies are being subjected to harsh environments that require unique advances in protection of their electronic circuits. This session will reveal new coating materials that incorporate nanoparticle technology, address low temperature curing processes utilizing transient phase liquid sintering technology, and tackle the challenges and impacts of converting to low VOC conformal coating materials.
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Evaluating Conformal Coatings For Use In A High Reliability Manufacturing Operation
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- Douglas Pauls, Rockwell Collins
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Multifunctional Nanocomposite Liquid-Repellent Coatings/Films for the Electronics Industry
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- Constantine Megaridis, University of Illinois at Chicago
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Lead-Free Die Attach Technology for High Power Applications
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- James Haley, Ormet Circuits, Inc.
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S03
Advances in Reliability Testing |
| Wednesday, August 22, 2012 | 3:15 PM - 5:00 PM |
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Moderator:
Venmathy Rajarathinam, Intel Corporation
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Product recalls have an impact on customer confidence and loyalty. In this session, industry experts will provide insight into minimizing soldering defects, focusing on analytical models to determine the ingress rate of moisture, the usage of capillary ion chromatography systems for determination of ionic species, and mitigation strategies for ensuring reliable ENIG solderability.
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Capillary IC – A New Platform for High Throughput or High Resolution Separations of Ionic Compounds
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- Peter Bodsky, Thermo Fisher Scientific
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Moisture Diffusion in Electronic Packaging Materials
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- Junaid Shafaat, Lotek Wireless Inc.
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Is the ENIG Process Evil or is it Maybe QA, Engineer or Sales Guy?
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- Chris Mahanna, Robisan Laboratory Inc.
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S04
Application Processing for Solder Related Materials |
| Thursday, August 23, 2012 | 8:00 AM - 10:00 AM |
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Moderator:
John Fisher, Interconnect Technology Analysis, Inc.
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This session will focus on innovative assembly processes for improving yields, service life and reliability. Industry experts will: address methods for cleaning assemblies using low volatility fluids and environmentally safe rinsing solvents; unveil unique solder paste jetting technology which allows for volume build-up by single dots to achieve the right solder paste for specific components; explore the challenges and cost drivers associated with supported mixed technology, RoHS/non-RoHS production; and discuss new methods for fabricated quick-turn "stepped" stencils to accommodate large and small solder paste volumes.
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Jetting Solder Paste Opens Up New Possibilities in Your SMT Production
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- Nico Coenen, MYDATA automation AB
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NPI Step Stencils-A New Approach
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- Jim French, BEST Inc.
- Robert Wettermann, BEST Inc.
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Dual Solvent Electronic Assembly Cleaning
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- Mike Bixenman, Kyzen Corporation
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S05
Assembly Process Soldering Materials |
| Thursday, August 23, 2012 | 10:15 AM - 11:45 AM |
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Moderator:
Greg Papandrew, Archon Power
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This session is a must for those looking to characterize lead-free solder alloys and maintain reliability in their soldering processes. Presenters will tackle the performance of low silver content alloys through thermal shock testing, evaluate whether decreased powder mesh size and increased oxide content of powder in package-on-package pastes affect the voiding performance of those materials, and provide data on the impact that modifications to the intermetallics of next-generation lead-free alloys have on reliability properties, such as tensile strength and shear.
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Reflow Soldering Equals Wave Soldering Plus One
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- Gerjan Diepstraten, Vitronics Soltec
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The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
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- Mario Scalzo, Indium Corporation of America
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New Developments in PCB Laminates
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- John Coonrod, Rogers Corporation
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